Composition :

Sn96.5Ag3Cu0.5 (96.5/3/0.5)

Diameter :

0.032"" (0.81mm)

Flux Type :

No-Clean

Form :

Spool, 1 lb (454 g)

Melting Point :

423°F (217°C)

Part Status :

Active

Process :

Lead Free

Shelf Life :

-

Shelf Life Start :

-

Storage/Refrigeration Temperature :

59°F ~ 86°F (15°C ~ 30°C)

Type :

Wire Solder

Wire Gauge :

20 AWG, 21 SWG