Attachment Method :

-

Diameter :

-

Height Off Base (Height of Fin) :

0.118"" (3.00mm)

Length :

0.394"" (10.00mm)

Material :

Ceramic

Material Finish :

-

Package Cooled :

Assorted (BGA, LGA, CPU, ASIC...)

Part Status :

Active

Power Dissipation @ Temperature Rise :

-

Shape :

Square

Thermal Resistance @ Forced Air Flow :

-

Thermal Resistance @ Natural :

-

Type :

Heat Spreader

Width :

0.394"" (10.00mm)