Architecture :

MCU, FPGA

Connectivity :

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Core Processor :

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Flash Size :

-

Operating Temperature :

-40°C ~ 100°C (TJ)

Package / Case :

780-BBGA, FCBGA

Part Status :

Active

Peripherals :

DMA, POR, WDT

Primary Attributes :

FPGA - 480K Logic Elements

RAM Size :

256kB

Speed :

1.5GHz

Supplier Device Package :

780-FBGA, FC (29x29)