Architecture :

MCU, FPGA

Connectivity :

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Core Processor :

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Flash Size :

-

Operating Temperature :

0°C ~ 85°C (TJ)

Package / Case :

896-BBGA, FCBGA

Part Status :

Active

Peripherals :

DMA, POR, WDT

Primary Attributes :

FPGA - 462K Logic Elements

RAM Size :

64kB

Speed :

700MHz

Supplier Device Package :

896-FBGA (31x31)