Architecture :

MCU, FPGA

Connectivity :

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Core Processor :

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Flash Size :

-

Operating Temperature :

-40°C ~ 100°C (TJ)

Package / Case :

672-FBGA

Part Status :

Active

Peripherals :

DMA, POR, WDT

Primary Attributes :

FPGA - 85K Logic Elements

RAM Size :

64kB

Speed :

800MHz

Supplier Device Package :

672-UBGA (23x23)