Architecture :

MCU, FPGA

Connectivity :

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Core Processor :

-

Flash Size :

-

Operating Temperature :

-40°C ~ 100°C (TJ)

Package / Case :

784-BFBGA, FCBGA

Part Status :

Active

Peripherals :

DMA, WDT

Primary Attributes :

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

RAM Size :

256kB

Speed :

500MHz, 600MHz, 1.2GHz

Supplier Device Package :

784-FCBGA (23x23)