Architecture :

MCU, FPGA

Connectivity :

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Core Processor :

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Flash Size :

-

Operating Temperature :

-40°C ~ 100°C (TJ)

Package / Case :

676-BBGA, FCBGA

Part Status :

Active

Peripherals :

DMA

Primary Attributes :

Kintex™-7 FPGA, 125K Logic Cells

RAM Size :

256kB

Speed :

800MHz

Supplier Device Package :

676-FCBGA (27x27)