Attachment Method :

Adhesive

Diameter :

-

Height Off Base (Height of Fin) :

0.008"" (0.21mm)

Length :

3.000"" (76.20mm)

Material :

Copper

Material Finish :

Polyester

Package Cooled :

Assorted (BGA, LGA, CPU, ASIC...)

Part Status :

Active

Power Dissipation @ Temperature Rise :

-

Shape :

Rectangular

Thermal Resistance @ Forced Air Flow :

-

Thermal Resistance @ Natural :

-

Type :

Heat Spreader

Width :

0.500"" (12.70mm)