Contact Finish - Mating :

Gold

Contact Finish - Post :

Gold

Contact Finish Thickness - Mating :

20.0µin (0.51µm)

Contact Finish Thickness - Post :

20.0µin (0.51µm)

Contact Material - Mating :

Beryllium Copper

Contact Material - Post :

Beryllium Copper

Features :

Closed Frame

Housing Material :

Polyphenylene Sulfide (PPS), Glass Filled

Mounting Type :

Through Hole

Number of Positions or Pins (Grid) :

44 (2 x 22)

Operating Temperature :

-

Part Status :

Active

Pitch - Mating :

-

Pitch - Post :

0.050"" (1.27mm)

Termination :

Solder

Type :

SOIC, ZIF (ZIP)