产品概览
产品详情
- Contact Finish - Mating :
- Gold
- Contact Finish - Post :
- Copper
- Contact Finish Thickness - Mating :
- 78.7µin (2.00µm)
- Contact Finish Thickness - Post :
- Flash
- Contact Material - Mating :
- Beryllium Copper
- Contact Material - Post :
- Brass
- Features :
- Open Frame
- Housing Material :
- Polybutylene Terephthalate (PBT), Glass Filled
- Mounting Type :
- Surface Mount
- Number of Positions or Pins (Grid) :
- 18 (2 x 9)
- Operating Temperature :
- -55°C ~ 125°C
- Part Status :
- Active
- Pitch - Mating :
- 0.100"" (2.54mm)
- Pitch - Post :
- 0.100"" (2.54mm)
- Termination :
- Solder
- Type :
- DIP, 0.3"" (7.62mm) Row Spacing
采购与价格
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- BU1851GUW-E2 ¥7.5512
- BU1852GUW-E2 ¥8.1441
推荐产品
- BU180Z-178-HT ¥18.9433
- BU1840AMUV-E2 ¥33.3372
- BU1850MUV-E2 ¥10.3666
- BU1851GUW-E2 ¥7.5512
- BU1852GUW-E2 ¥8.1441