Contact Finish - Mating :

Gold

Contact Finish - Post :

Gold

Contact Finish Thickness - Mating :

30.0µin (0.76µm)

Contact Finish Thickness - Post :

30.0µin (0.76µm)

Contact Material - Mating :

Beryllium Copper

Contact Material - Post :

Beryllium Copper

Features :

-

Housing Material :

Polysulfone (PSU), Glass Filled

Mounting Type :

Through Hole

Number of Positions or Pins (Grid) :

10 (1 x 10)

Operating Temperature :

-55°C ~ 125°C

Part Status :

Active

Pitch - Mating :

0.100"" (2.54mm)

Pitch - Post :

0.100"" (2.54mm)

Termination :

Solder

Type :

SIP, ZIF (ZIP)