产品概览

产品型号
808-AG11D
现有数量
2,399
制造商
TE Connectivity AMP Connectors
产品类别
IC、晶体管插座
产品描述
CONN IC DIP SOCKET 8POS GOLD

产品详情

Contact Finish - Mating :
Gold
Contact Finish - Post :
Tin-Lead
Contact Finish Thickness - Mating :
25.0µin (0.63µm)
Contact Finish Thickness - Post :
80.0µin (2.03µm)
Contact Material - Mating :
Copper Alloy
Contact Material - Post :
Copper Alloy
Features :
Open Frame
Housing Material :
Polyester
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
8 (2 x 4)
Operating Temperature :
-55°C ~ 105°C
Part Status :
Active
Pitch - Mating :
0.100"" (2.54mm)
Pitch - Post :
0.100"" (2.54mm)
Termination :
Solder
Type :
DIP, 0.3"" (7.62mm) Row Spacing

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