Contact Finish - Mating :

Gold

Contact Finish - Post :

Gold

Contact Finish Thickness - Mating :

30.0µin (0.76µm)

Contact Finish Thickness - Post :

30.0µin (0.76µm)

Contact Material - Mating :

Copper Alloy

Contact Material - Post :

Copper Alloy

Features :

Open Frame

Housing Material :

Thermoplastic

Mounting Type :

Surface Mount

Number of Positions or Pins (Grid) :

2092

Operating Temperature :

-25°C ~ 100°C

Part Status :

Active

Pitch - Mating :

0.039"" (1.00mm)

Pitch - Post :

0.034"" (0.86mm)

Termination :

Solder

Type :

LGA 4189